Patrick McCluskey: search on Z-Library

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1

Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module

Wang, Peng, McCluskey, Patrick, Bar-Cohen, Avram

Journal:

Journal of Electronic Packaging

Year:

2013

Language:

english

File:

PDF, 2.91 MB

english, 2013

2

Mechanism of wire bond shear testing

Manoharan, Subramani, Patel, Chandradip, Hunter, Stevan, McCluskey, Patrick

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.60 MB

english, 2018

3

Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment

Manoharan, Subramani, Patel, Chandradip, McCluskey, Patrick, Pecht, Michael

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 3.34 MB

english, 2018

4

[IEEE 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2016.7.18-2016.7.21)] 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Failure mechanisms in encapsulated copper wire-bonded devices

Manoharan, Subramani, KrishnanRamaswami, Gopal, McCluskey, F. Patrick, Pecht, Michael G.

Year:

2016

Language:

english

File:

PDF, 875 KB

english, 2016

5

Analysis of indentation measured mechanical properties on Multilayer Ceramic Capacitors (MLCCs)

Li, Nga Man, Manoharan, Subramani, Das, Diganta, McCluskey, Patrick

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.42 MB

english, 2018

6

Review of shelf life evaluation methods and a physics of failure approach for shelf life estimation for electronic components

Li, Nga Man Jennifa, Das, Diganta, McCluskey, Patrick

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 612 KB

english, 2019

7

[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse, France (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Modeling the influence of mold compound and temperature profile on board level reliability of single die QFN packages

Serebreni, Maxim, McCluskey, Patrick, Ferris, Tyler, Sharon, Gil, Blattau, Nathan, Hillman, Craig

Year:

2018

Language:

english

File:

PDF, 579 KB

english, 2018

8

[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Advancements in Silver Wire Bonding

Manoharan, Subramani, Patel, Chandradip, McCluskey, Patrick

Year:

2017

Language:

english

File:

PDF, 1.71 MB

english, 2017

9

[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Cooling of Integrated Electric Motors

Yao, Zhaoxi, Saadon, Yonatan, Mandel, Raphael, Patrick McCluskey, F.

Year:

2020

File:

PDF, 1.06 MB

2020

10

Reliable use of commercial technology in high temperature environments

Patrick McCluskey, Kofi Mensah, Casey O'Connor, Anthony Gallo

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 593 KB

english, 2000

11

MAIT cells launch a rapid, robust and distinct hyperinflammatory response to bacterial superantigens and quickly acquire an anergic phenotype that impedes their cognate antimicrobial function: Defining a novel mechanism of superantigen-induced immunopathology and immunosuppression

Shaler, Christopher R., Choi, Joshua, Rudak, Patrick T., Memarnejadian, Arash, Szabo, Peter A., Tun-Abraham, Mauro E., Rossjohn, Jamie, Corbett, Alexandra J., McCluskey, James, McCormick, John K., Lan

Journal:

Year:

2017

Language:

english

File:

PDF, 19.87 MB

english, 2017

12

SPIE Proceedings [SPIE Smart Structures and Materials - San Diego, CA (Sunday 26 February 2006)] Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology - Packaging of an iron-gallium nanowire acoustic sensor

DiSabatino, Jr., Ronald J., Varadan, Vijay K., McCluskey, F. Patrick, Flatau, Alison B., Stadler, Bethanie J. H.

Year:

2006

Language:

english

File:

PDF, 628 KB

english, 2006

13

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Mechanics of Copper Wire Bond Failure due to Thermal Fatigue

Manoharan, Subramani, Li, Nga Man Jennifa, Patel, Chandradip, Hunter, Stevan, McCluskey, Patrick

Year:

2018

Language:

english

File:

PDF, 33 KB

english, 2018

14

Unprecedented tunability of riboswitch structure and regulatory function by sub-millimolar variations in physiological Mg2+

McCluskey, Kaley, Boudreault, Julien, St-Pierre, Patrick, Perez-Gonzalez, Cibran, Chauvier, Adrien, Rizzi, Adrien, Beauregard, Pascale B, Lafontaine, Daniel A, Penedo, J Carlos

Journal:

Nucleic Acids Research

Year:

2019

Language:

english

File:

PDF, 2.50 MB

english, 2019

15

Predictors of morbidity following free flap reconstruction for cancer of the head and neck

Jonathan R. Clark, Stuart A. McCluskey, Francis Hall, Joan Lipa, Peter Neligan, Dale Brown, Jonathan Irish, Patrick Gullane, Ralph Gilbert

Journal:

Year:

2007

Language:

english

File:

PDF, 186 KB

english, 2007

16

Numerical investigation and sensitivity analysis of manifold microchannel coolers

Boteler, Lauren, Jankowski, Nicholas, McCluskey, Patrick, Morgan, Brian

Journal:

International Journal of Heat and Mass Transfer

Year:

2012

Language:

english

File:

PDF, 2.11 MB

english, 2012

17

Temperature Cycling Reliability of High-Temperature Lead-Free Die-Attach Technologies

Quintero, Pedro O., McCluskey, F. Patrick

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2011

Language:

english

File:

PDF, 981 KB

english, 2011

18

Cardiac output-based fluid optimization for kidney transplant recipients: a proof-of-concept trial; Gestion optimisée des liquides basée sur le débit cardiaque chez les transplantés rénaux : un essai de preuve de concept;

Corbella, Davide, Toppin, Patrick Jason, Ghanekar, Anand, Ayach, Nour, Schiff, Jeffery, Van Rensburg, Adrian, McCluskey, Stuart A.

Journal:

Canadian Journal of Anesthesia/Journal canadien d'anesthésie

Year:

2018

File:

PDF, 734 KB

2018

19

Hybrid Solid- and Liquid-Cooling Solution for Isothermalization of Insulated Gate Bipolar Transistor Power Electronic Devices

Wang, Peng, McCluskey, Patrick, Bar-Cohen, Avram

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1018 KB

english, 2013

20

Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications

Nishimoto, Shuji, Moeini, Seyed Ali, Ohashi, Toyo, Nagatomo, Yoshiyuki, McCluskey, Patrick

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.49 MB

english, 2018

21

Nano-thermal transport array: An instrument for combinatorial measurements of heat transfer in nanoscale films

Patrick J. McCluskey, Joost J. Vlassak

Journal:

Thin Solid Films

Year:

2010

Language:

english

File:

PDF, 1.74 MB

english, 2010

22

Unprecedented tunability of riboswitch structure and regulatory function by sub-millimolar variations in physiological Mg2+

McCluskey, Kaley, Boudreault, Julien, St-Pierre, Patrick, Perez-Gonzalez, Cibran, Chauvier, Adrien, Rizzi, Adrien, Beauregard, Pascale B, Lafontaine, Daniel A, Penedo, J Carlos

Journal:

Nucleic Acids Research

Year:

2019

File:

PDF, 2.50 MB

2019

23

Combinatorial nanocalorimetry

McCluskey, Patrick J., Vlassak, Joost J.

Journal:

Journal of Materials Research

Year:

2010

Language:

english

File:

PDF, 1.09 MB

english, 2010

24

[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration - Performance Degradation of the MEMS Vibratory Gyroscope in Harsh Environments

Patel, Chandradip, McCluskey, Patrick

Year:

2011

Language:

english

File:

PDF, 998 KB

english, 2011

25

[ASME ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME 2007 InterPACK Conference, Volume 1 - Reliability of Indium Solder for Cold Temperature Packaging

Wu, Rui, McCluskey, F. Patrick

Year:

2007

Language:

english

File:

PDF, 123 KB

english, 2007

26

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Reliability modeling of a single phase liquid cooling system for power electronics applications

DeVoto, Douglas, McCluskey, Patrick

Year:

2010

Language:

english

File:

PDF, 549 KB

english, 2010

27

Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review

Oh, Hyunseok, Han, Bongtae, McCluskey, Patrick, Han, Changwoon, Youn, Byeng D.

Journal:

IEEE Transactions on Power Electronics

Year:

2015

Language:

english

File:

PDF, 676 KB

english, 2015

28

Microcontact-Enhanced Thermoelectric Cooling of Ultrahigh Heat Flux Hotspots

Manno, Michael, Yang, Bao, Khanna, Sumeer, McCluskey, Patrick, Bar-Cohen, Avram

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 1.03 MB

english, 2015

29

Use of ultrasound to demonstrate gallstones in symptomatic patients with normal oral cholecystograms

Patrick L. McCluskey, Richard A. Prinz, Rogelio Guico, Herbert B. Greenlee

Journal:

The American Journal of Surgery

Year:

1979

Language:

english

File:

PDF, 360 KB

english, 1979

30

[ASME ASME 2009 International Mechanical Engineering Congress and Exposition - Lake Buena Vista, Florida, USA (November 13–19, 2009)] Volume 5: Electronics and Photonics - A Micromachined Manifold Microchannel Cooler

Boteler, Lauren, Jankowski, Nicholas, Geil, Bruce, McCluskey, Patrick

Year:

2009

Language:

english

File:

PDF, 1.60 MB

english, 2009

31

[IEEE 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL (2017.5.30-2017.6.2)] 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Integration of micro-contact enhanced thermoelectric cooler with a FEEDS manifold-microchannel system for cooling of high flux electronics

Yuruker, Sevket U., Bae, Daniel G., Mandel, Raphael K., Yang, Bao, McCluskey, Patrick, Bar-Cohen, Avram, Ohadi, Michael M.

Year:

2017

File:

PDF, 671 KB

2017

32

[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermo-Mechanical Design Considerations in 3D-Integrated SiC Power Device Package

McCluskey, F. Patrick, Yun, He, Buxbaum, Clifton Edward, Yuruker, Sevket, Mandel, Raphael, Ohadi, Michael, Park, Yongwan, Chakraborty, Shiladri, Khaligh, Alireza, Boteler, Lauren, Hinojosa, Miguel

Year:

2020

File:

PDF, 930 KB

2020

33

[ASME ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, California, USA (Monday 6 July 2015)] Volume 1: Thermal Management - Modeling Thermal Spreading Resistance in Via Arrays

Fish, Michael, McCluskey, Patrick, Bar-Cohen, Avram

Year:

2015

Language:

english

File:

PDF, 2.12 MB

english, 2015

34

PREDICTION AND MITIGATION OF VERTICAL CRACKING IN HIGH-TEMPERATURE TRANSIENT LIQUID PHASE SINTERED JOINTS BY THERMO-MECHANICAL SIMULATION

Greve, Hannes, Moeini, S. Ali, McCluskey, Patrick, Joshi, Shailesh

Journal:

Journal of Electronic Packaging

Year:

2018

Language:

english

File:

PDF, 1.70 MB

english, 2018

35

[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Embedded Fluid Cooling of Close-Packed Via Arrays in Glass

Fish, Michael, Martinis, Bradley, McCluskey, Patrick, Bar-Cohen, Avram

Year:

2018

Language:

english

File:

PDF, 1.42 MB

english, 2018

36

Scanning AC nanocalorimetry combined with in-situ x-ray diffraction

Xiao, Kechao, Gregoire, John M., McCluskey, Patrick J., Dale, Darren, Vlassak, Joost J.

Journal:

Journal of Applied Physics

Year:

2013

Language:

english

File:

PDF, 3.15 MB

english, 2013

37

Application of in-situ nano-scanning calorimetry and X-ray diffraction to characterize Ni–Ti–Hf high-temperature shape memory alloys

McCluskey, Patrick J., Xiao, Kechao, Gregoire, John M., Dale, Darren, Vlassak, Joost J.

Journal:

Thermochimica Acta

Year:

2015

Language:

english

File:

PDF, 2.40 MB

english, 2015

38

Thermomechanical recovery couplings of shape memory polymers in flexure

Liu, Yiping, Gall, Ken, Dunn, Martin L, McCluskey, Patrick

Journal:

Smart Materials and Structures

Year:

2003

Language:

english

File:

PDF, 197 KB

english, 2003

39

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Microstructural Evolution of Transient Liquid Phase Sinter Joints in High Temperature Environmental Conditions

Greve, Hannes, Moeini, S. Ali, McCluskey, F. Patrick, Joshi, Shailesh

Year:

2016

Language:

english

File:

PDF, 910 KB

english, 2016

40

[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Wire Flexure Fatigue Model for Asymmetric Bond Height

Meyyappan, Karumbu Nathan, Hansen, Peter, McCluskey, Patrick

Year:

2003

Language:

english

File:

PDF, 408 KB

english, 2003

41

[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration - Thermal Performance and Reliability of Large-Area Bonded Interfaces in Power Electronics Packages

Narumanchi, Sreekant, DeVoto, Douglas, Mihalic, Mark, Popp, Tim, McCluskey, Patrick

Year:

2011

Language:

english

File:

PDF, 1.38 MB

english, 2011

42

Multicenter clinical experience with rescue atherectomy for failed angioplasty

Edward R. McCluskey, Michael Cowley, Patrick L. Whitlow

Journal:

The American Journal of Cardiology

Year:

1993

Language:

english

File:

PDF, 4.46 MB

english, 1993

43

AS24 The relationship between healthcare staff height and the ability to perform effective chest compressions in adults

Trevor McNulty, Patrick Gallagher, B.J. Rice, David McCluskey, Chris Walsh

Journal:

Year:

2011

Language:

english

File:

PDF, 66 KB

english, 2011

44

The Effect of Pilocarpine on the Visual Field in Normals

McCluskey, Druann J., Douglas, John P., O'Connor, Patrick S., Story, Kristin, Ivy, Linda M., Harvey, J. Steven

Journal:

Year:

1986

Language:

english

File:

PDF, 625 KB

english, 1986

45

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Reliability of paste based transient liquid phase sintered interconnects

Greve, Hannes, Moeini, S. Ali, McCluskey, F. Patrick

Year:

2014

File:

PDF, 3.88 MB

2014

46

[IEEE 2014 Lester Eastman Conference on High Performance Devices (LEC) - Ithaca, NY, USA (2014.8.5-2014.8.7)] 2014 Lester Eastman Conference on High Performance Devices (LEC) - S2-T6: Microchannel cooled, high power GaN-on-Diamond MMIC

Creamer, C. T., Chu, K. K., Chao, P. C., Schmanski, B., Yurovchak, T., Sweetland, S., Campbell, Geoff, Eppich, Henry, Ohadi, Michael, McCluskey, Patrick

Year:

2014

Language:

english

File:

PDF, 1.59 MB

english, 2014

47

Blood Transfusion Prediction in Patients Undergoing Major Head and Neck Surgery With Free-Flap Reconstruction

Shah, Manish D., Goldstein, David P., McCluskey, Stuart A., Miles, Brett A., Hofer, Stefan O., Brown, Dale H., Irish, Jonathan C., Gullane, Patrick J., Gilbert, Ralph W.

Journal:

Archives of Otolaryngology - Head and Neck Surgery

Year:

2010

Language:

english

File:

PDF, 86 KB

english, 2010

48

[IEEE 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Cooling for Electric Aircraft Motors

McCluskey, F. Patrick, Saadon, Yonatan, Yao, Zhaoxi, Camacho, Alexander

Year:

2019

Language:

english

File:

PDF, 2.53 MB

english, 2019

49

MEMS Package for an Iron–Gallium Nanowire-Based Acoustic Sensor

Jain, Rupal, McCluskey, F. Patrick, Flatau, Alison B.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 1.64 MB

english, 2011

50

A scanning AC calorimetry technique for the analysis of nano-scale quantities of materials

Xiao, Kechao, Gregoire, John M., McCluskey, Patrick J., Vlassak, Joost J.

Journal:

Review of Scientific Instruments

Year:

2012

Language:

english

File:

PDF, 3.16 MB

english, 2012

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